Qorvo的TGL2217-SM是一种封装的高功率,能够保护敏感接收通道组件免受高功率入射信号的封装大功率。TGL2217-SM不需要DC偏压并以小形式因子达到较低的插入损耗。这些功能允许简单地集成,对系统性能的影响最小。
The TGL2217-SM operates from 0.1–20.0 GHz with low insertion loss of less than 0.9 dB. Receive protection is rated up to 10 W incident pulsed-power with a low flat leakage of less than 18.5 dBm.
TG12217-SM为小型电路板级组件的小型3.5 x 3.5 mm QFN封装提供。在两个RF端口完全匹配到50欧姆,它非常适合商业和防御相关应用。
Lead-free and RoHS compliant.
可应要求提供评估板。
频率最小(GHz) | 0.1 |
频率最大(GHz) | 20 |
Insertion Loss(dB) | < 0.9 |
扁平泄漏(DBM) | < 18.5 |
包装类型 | QFN. |
Package(毫米) | 3.。5 x 3.5 x 1.64 |
rohs. | Yes |
Lead Free | Yes |
卤素免费 | Yes |
ITAR受到限制 | 不 |
ECCN. | EAR99 |
该产品可作为X-MicroWave块(X-MWblock)提供,用于评估。
x-mwblock.s are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.